SemiconductorWe are a well-established global player and solutions provider of advanced technologies in the semiconductor industry. Through long-term partnerships with the market leaders in machine building and with influential entities such as SEMI, we have acquired the necessary knowledge and know-how to become a leading player for equipping these machines with products that include sensors, PLCs and servo-drives and safety components.
Moulding/ Trim & Form
The bonded chip on the lead frame is encased in a synthetic resin or ceramic package in the moulding process. The lead frame is then trimmed off and formed into the shape required to mount the IC on a circuit board.
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Due to the various shapes of IC chips, the specifications and system configuration of the machinery has to be flexible.
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